INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战：高能效、移动性和安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

S26HS512TGABHI013

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S28HS01GTGZBHI030

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 400.0MByte/s Interfaces: Octal Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): 166 / 200 Density: 1.0GBit Currently planned availability until at least: 2035

S28HS02GTFPBHB153

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Classification: ISO 26262-compliant Family: HS-T Interface Bandwidth: 333.0MByte/s Interface Frequency (SDR/DDR)(MHz): 166 / 166 Interfaces: Octal Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Qualification: Automotive Density: 2.0GBit Currently planned availability until at least: 2035

S26HL01GTFPBHM020

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 125.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

S28HS01GTFPBHM033

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

S28HS01GTFPBHV033

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Density: 1.0GBit Currently planned availability until at least: 2035

S26HL01GTFPBHB030

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

S26HL512TFPBHM000

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

S26HL512TFPBHI010

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): - / 166 Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S28HS02GTFPBHV053

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 333.0MByte/s Interfaces: Octal Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): - / 166 Density: 2.0GBit Currently planned availability until at least: 2035