INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Family: DDR-II CIO
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
| 库存数量: | 0 |
Bank Switching: N
Burst Length(Words): 2
Data Width: x 18
ECC: N
Family: DDR-II+ CIO, ODT
Frequency: 550.0MHz
| 库存数量: | 0 |
Bank Switching: N
Data Width: x 36
ECC: Y
Frequency: 200.0MHz
Lead Ball Finish: Ni/Pd/Au
On-Die Termination: N
| 库存数量: | 0 |
Architecture: DDR-II+ CIO
Bank Switching: N
Burst Length(Words): 2
Data Width: x 36
Family: DDR-II+ CIO
Frequency: 450.0MHz
| 库存数量: | 0 |
Architecture: DDR-II CIO
Bank Switching: N
Burst Length(Words): 2
ECC: N
Family: DDR-II CIO
Frequency: 333.0MHz
| 库存数量: | 0 |
Family: DDR-II CIO
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
| 库存数量: | 0 |
Architecture: Standard Sync, Flow-through
Bank Switching: N
Burst Length(Words): 4
Data Width: x 36
Family: Synchronous SRAM with ECC
Lead Ball Finish: Pure Sn
| 库存数量: | 0 |
Family: DDR-II CIO
Lead Ball Finish: Sn/Pb
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
| 库存数量: | 0 |
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Operating Voltage: NoneV
Interfaces: Parallel
Family: MoBL™ SRAM
| 库存数量: | 0 |
Bank Switching: N
Data Width: x 36
ECC: Y
Family: Synchronous SRAM with ECC
Frequency: 133.0MHz
Lead Ball Finish: Ni/Pd/Au
| 库存数量: | 0 |