INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Lead Ball Finish: Ni/Pd/Au
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 256K x 16
Peak Reflow Temp: 260.0°C
| 库存数量: | 0 |
Bank Switching: N
Burst Length(Words): 4
Data Width: x 36
Family: Synchronous SRAM with ECC
Frequency: 133.0MHz
Lead Ball Finish: Pure Sn
| 库存数量: | 0 |
Architecture: DDR-II CIO
Bank Switching: N
Burst Length(Words): 2
Data Width: x 36
ECC: N
Lead Ball Finish: Sn/Ag/Cu
| 库存数量: | 0 |
Architecture: NoBL, Flow-through
Burst Length(Words): 4
Data Width: x 36
ECC: Y
Frequency: 133.0MHz
Lead Ball Finish: Pure Sn
| 库存数量: | 0 |
Family: DDR-II CIO
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Operating Voltage: NoneV
Interfaces: Parallel
| 库存数量: | 0 |
Architecture: DDR-II+ CIO, ODT
Burst Length(Words): 2
Data Width: x 36
Family: DDR-II+ CIO, ODT
Lead Ball Finish: Sn/Ag/Cu
On-Die Termination: Y
| 库存数量: | 0 |
Architecture: DDR-II+ CIO, ODT
Bank Switching: N
Burst Length(Words): 2
ECC: N
Family: DDR-II+ CIO, ODT
Frequency: 550.0MHz
| 库存数量: | 0 |
Family: QDR-II+
Lead Ball Finish: Sn/Ag/Cu
Operating Voltage: NoneV
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
| 库存数量: | 0 |
Family: QDR-II
Lead Ball Finish: Sn/Ag/Cu
Operating Voltage: NoneV
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
| 库存数量: | 0 |
Architecture: QDR-II
Bank Switching: N
Burst Length(Words): 2
Data Width: x 36
Family: QDR-II
Lead Ball Finish: Sn/Ag/Cu
| 库存数量: | 0 |