INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战：高能效、移动性和安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

SLC32PDL348

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

NVM / 凌捷掩膜: 348.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 10.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Coil on Module Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Certifications: CUP Applications: payment Delivery Forms: Coil on Module Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

Interfaces: optimized for small antenna sizes Package: MCC8 Package: P-M8.4-8-3 Package: P-MCC8-2-6 Package: T-M8.8-8-x Product Description: dual-interface and contactless security cryptocontroller Interfaces: ISO 14443 A/B Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)

SLC26PDA360N9

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: TEGRION™ 28nm security controllers for payment applications

Ambient Temperature max: 85.0°C Applications: Payment NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Certifications: EMVco Certifications: CC EAL6+ Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: optimized for small antenna sizes Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Interfaces: ISO 14443 A/B CPU: TEGRION™ 32-bit Arm® v8-M

SLC32PDA348

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

NVM / 凌捷掩膜: 348.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 16-bit Certifications: CUP Certifications: EMVCo RAM: 10.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Coil on Module Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Certifications: CC EAL6+ high Applications: payment Delivery Forms: Coil on Module Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: optimized for small antenna sizes Interfaces: ISO 18092 passive mode 更多

Interfaces: ISO 7816 Interfaces: ISO 14443 A/B Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Package: MCC8 Product Description: dual-interface and contactless security cryptocontroller

SLC32PCA300

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

NVM / 凌捷掩膜: 300.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: payment Delivery Forms: MFC6.6 Delivery Forms: MFC6.8 Delivery Forms: sawn wafer Interfaces: ISO 7816 Product Description: contact-based security cryptocontroller

SLC36PDZXXX

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: 40nm SLC3x products enhance user experience for excellent performance and flexibility

Ambient Temperature max: 85.0°C Applications: payment Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Arm® SecurCore® SC300 Certifications: CC EAL6+ high targeted Certifications: EMVCo (targeted) Delivery Forms: sawn wafer Delivery Forms: bumped wafer Delivery Forms: 6/8 pin dual-interface modules and contactless modules Interfaces: ISO 7816 / I2C Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: optimized for small antenna sizes Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Leading Technologies: SOLID FLASH™ Leading Technologies: Coil on Module NVM / 凌捷掩膜 max: 352.0kByte RAM: 12.0kByte Certifications: CUP (targeted) 更多

Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES

SLC37GDAXXX

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

SLC38BML800

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors

Product Description: Dual-interface security cryptocontroller Leading Technologies: SOLID FLASH™ Applications: payment Interfaces: UART Interfaces: GPIO Interfaces: I2C slave Interfaces: 2-wire SPI master functionality Interfaces: ISO/IEC 7816 Interfaces: ISO/IEC 14443 A/B Interfaces: ISO/IEC 18092 (NFC passive mode) NVM / 凌捷掩膜: 800.0kByte RAM: 24.0kByte CPU: 32-bit Symmetric Cryptography: DES Symmetric Cryptography: 3-DES Symmetric Cryptography: AES up to 256-bit Asymmetric Cryptography: RSA up to 4096-bit Asymmetric Cryptography: ECC up to 521-bit Ambient Temperature max: 85.0°C Certifications: EMVCo 更多

Certifications: CC EAL6+ high Delivery Forms: Wafer sawn Delivery Forms: X2QFN-24-1 Delivery Forms: Wafer sawn

SLC39BML1M0F7

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors

Leading Technologies: SOLID FLASH™ Applications: payment Interfaces: UART Interfaces: GPIO Interfaces: I2C slave Interfaces: I2C master Interfaces: SPI master Interfaces: Power Source Interfaces: Contactless interface (RFI) Interfaces: ISO/IEC 7816 contact-based interface Interfaces: ISO/IEC 14443 Type A and B Interfaces: ISO/IEC 18092 (NFC passive mode) Interfaces: Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1) NVM / 凌捷掩膜: 1024.0kByte RAM: 96.0kByte CPU: 32-bit Symmetric Cryptography: DES Symmetric Cryptography: 3-DES Symmetric Cryptography: AES up to 256-bit Asymmetric Cryptography: RSA up to 4096-bit 更多

Asymmetric Cryptography: ECC up to 521-bit Ambient Temperature max: 85.0°C Certifications: EMVCo Certifications: CC EAL6+ high Delivery Forms: X2QFN-24-1 Delivery Forms: Wafer sawn

SLC39BIL800F3

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors

Leading Technologies: SOLID FLASH™ Applications: payment Interfaces: UART Interfaces: GPIO Interfaces: I2C master Interfaces: Power Source Interfaces: Contactless interface (RFI) Interfaces: ISO/IEC 7816 contact-based interface Interfaces: ISO/IEC 14443 Type A and B Interfaces: ISO/IEC 18092 (NFC passive mode) Interfaces: Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1) NVM / 凌捷掩膜: 800.0kByte RAM: 64.0kByte CPU: 32-bit Symmetric Cryptography: DES Symmetric Cryptography: 3-DES Symmetric Cryptography: AES up to 256-bit Asymmetric Cryptography: RSA up to 4096-bit Asymmetric Cryptography: ECC up to 521-bit Ambient Temperature max: 85.0°C 更多

Certifications: EMVCo Certifications: CC EAL6+ high Delivery Forms: X2QFN-24-1 Delivery Forms: Wafer sawn

SLC3XGDAXXX

分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

简介: Dual-Interface security controllers with SOLID FLASH™ and 32-bit Arm® SecurCore® SC300 technology for government identification

Product Description: dual-interface security cryptocontroller Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Leading Technologies: Coil on Module Leading Technologies: Mega Memory Applications: government identification Interfaces: ISO 7816 Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) NVM / 凌捷掩膜 max: 352.0kByte NVM / 凌捷掩膜 max: 512.0kByte NVM / 凌捷掩膜 max: 800.0kByte RAM: 16.0kByte RAM: 24.0kByte CPU: 32-bit Arm® SecurCore® SC300 Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit 更多

Delivery Forms: sawn wafer Delivery Forms: bumped wafer Delivery Forms: Coil on Module Delivery Forms: dual-interface and contactless modules Certifications: CC EAL6+ high Certifications: EMVCo Ambient Temperature max: 85.0°C