Applications: government identification Asymmetric Cryptography: ECC up to xxx-bit Asymmetric Cryptography: RSA up to xxxx-bit Certifications: eMRTD CC EAL5+ high targeted Interfaces: ISO 14443 A/B Interfaces: ISO 14443 VHBR Interfaces: ISO 7816 Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Leading Technologies: VHBR OS Provider: SECORA™ ID S Version 1.0 Supported Standards: GP 2.3.1 Supported Standards: JC 3.0.5 Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: 3DES Use Cases: National eID Use Cases: ePassport Use Cases: eHealth card Use Cases: eDrivers License Use Cases: eSignature Use Cases: ISO7816-4 Data structure for customization

Applications: NFC device pairing Counter: 16-bit counter Counter: anti-tearing support Data Rate: 106kbit/s to card Data Rate: 106kbit/s to reader Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 10cm and above EEPROM(admin): 24.0Byte EEPROM(user): 128.0Byte Endurance: 10000 Interfaces: ISO/IEC 14443-3 Type A Interfaces: NFC Forum Type 2 Tag operation Retention Time min: 5.0year Security Features: 32-bit password protection for read and/or write access Security Features: block locking Security Features: individual page locking Security Features: password retry counter Security Features: unique serial number Tools: evaluation kit contactless 更多

Interfaces: SWI EEPROM: 2.0kBit CPU: n/a Symmetric Cryptography: 80BIT_MAC Asymmetric Cryptography: 163bits ICC Ambient Temperature max: 85.0°C Certifications: n/a Delivery Forms: TSPN6-16 Use Cases: Mobile device battery authentication Applications: Mobile devices Applications: Small electronic devices

Applications: supply chain management Counter: anti-tearing support Counter: up to 65,536 units Data Rate: 26.48kbit/s Delivery Forms: MCC2 Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 1.5m EEPROM(admin): 256.0Byte EEPROM(user): 1000.0Byte Endurance: 100000 Interfaces: ISO/IEC 18000-3 mode 1 Package: MCC2 Package: MCC8 Product Description: my-d™ vicinity Retention Time min: 10.0year Security Features: individual page locking Security Features: unique serial number Tools: evaluation kit contactless 更多

Control Interface: GPIO Switch Type: SP4T Frequency Range: 0.1 - 6.0 GHz Size: 1.1 x 1.5 mm²

Applications: transport ticketing Counter: 16-bit counter Counter: anti-tearing support Data Rate: 106kbit/s to card Data Rate: 106kbit/s to reader Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 10cm and above EEPROM(admin): 24.0Byte EEPROM(user): 128.0Byte Endurance: 10000 Interfaces: ISO/IEC 14443-3 Type A Interfaces: NFC Forum Type 2 Tag operation Retention Time min: 5.0year Security Features: 32-bit password protection for read and/or write access Security Features: block locking Security Features: individual page locking Security Features: password retry counter Security Features: unique serial number Tools: evaluation kit contactless 更多

Applications: Government Identification Ambient Temperature max: 85.0°C Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Certifications: EMVCo Certifications: CC EAL6+ high Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: Very High Bit Rates (VHBR) Interfaces: ISO 7816 NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES Symmetric Cryptography: 3DES Product Description: SLC26GDA360 CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Certifications: EMVco Certifications: CC EAL6+ Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: ISO 14443 A/B Interfaces: Optimized for small antenna sizes Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Certifications: EMVco NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: optimized for small antenna sizes Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Interfaces: ISO 14443 A CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Certifications: EMVco NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: ISO 14443 A Interfaces: optimized for small antenna sizes Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES CPU: TEGRION™ 32-bit Arm® v8-M