INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
NVM / 凌捷掩膜: 320.0kByte
CPU: 16-bit
RAM: 8.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
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Pitch: 14.25mm
Product Name: P-M4.8
Product Description: contact-based module
Dimensions: 13 x 11.8mm
Thickness: max. 600μm
Contact Surface: NiAu
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NVM / 凌捷掩膜: 256.0kByte
CPU: 16-bit
RAM: 8.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
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SLM97CF1M00PE
分类:简介: High-end performance for eSIM applications, simplifying the deployment of new M2M solutions
NVM / 凌捷掩膜: 1.0MByte
CPU: 32-bit
Certifications: CC EAL5+ high
RAM: 32.0kByte
Leading Technologies: SOLID FLASH™
Ambient Temperature: None°C
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Applications: FIDO security keys
Applications: authentication & access tokens
Applications: USB tokens
Applications: software protection dongles
Applications: cold wallet tokens
Asymmetric Cryptography: ECC up to 521-bit
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Product Description: USB-security cryptocontroller
Leading Technologies: SOLID FLASH™
Leading Technologies: USB
Applications: FIDO security keys
Applications: authentication & access tokens
Applications: USB tokens
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Pitch: 9.5mm
Product Name: S-MFC6.6
Product Description: contact-based module
Dimensions: 11 x 8.3mm
Thickness: max. 420µm
Contact Surface: NiAu
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Product Description: contact-based module
Pitch: 14.25mm
Dimensions: 13 x 11.8mm
Contact Surface: NiAu
ISO – Reference: ISO 7816-1
Derivatives: Pd surface
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Pitch: 9.5mm
Product Name: P-MCS8-2-1
Product Description: thin contactless module
Dimensions: 8.1 x 5.15mm
Thickness: max. 250µm
Contact Surface: Ag
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