Product Description: dual interface module Product Name: S-COM10.6 Pitch: 14.25mm Dimensions: 13 x 11.8mm Thickness: max. 420µm Contact Surface: NiAu ISO – Reference: ISO 7816-1 Derivatives: Pd surface Delivery Forms: Tape on Reel Applications: government identification Applications: authentication ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 Leading Technologies: Coil on module Product Description: with inductive coupling Product Description: for high demanding applications, ISO – Reference: ISO 14443 Applications: payment Derivatives: Au surface

Applications: payment Contact Surface: NiAu Delivery Forms: Tape on Reel Derivatives: Pd surface Dimensions: 11 x 8.3mm ISO – Reference: ISO 7816-1 ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 Product Description: dual interface module Product Description: inductive coupling Pitch: 9.5mm Thickness: max. 320µm Product Name: S-COM8.4 Leading Technologies: Coil on module Product Description: 6 CB contacts ISO – Reference: ISO 14443 Derivatives: Au surface

Applications: authentication Applications: government identification Contact Surface: NiAu Delivery Forms: Tape on Reel Derivatives: Au surface Derivatives: Pd surface Dimensions: 13 x 11.8 mm ISO – Reference: ISO 7816-1 ISO – Reference: ISO 10373-1/-3 ISO – Reference: ISO 7810 ISO – Reference: ISO 14443 Leading Technologies: Coil on module Pitch: 14.25mm Product Name: S-COM10.8 Thickness: max. 420 µm

Pitch: 9.5mm Product Name: P-MCC8-2-6 Product Description: standard contactless module Dimensions: 8.1 x 5.15mm Thickness: max. 340μm Contact Surface: Ag ISO – Reference: ISO 7816-1 Delivery Forms: Tape on Reel Applications: payment Applications: transport ticketing Applications: government identification ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 ISO – Reference: ISO 14443 Product Description: mold

Applications: Consumer electronic accessories Applications: Consumables Applications: Luxury goods Applications: Track and trace Applications: Access control Applications: Toys Applications: Medical devices Applications: Pharmaceuticals Certifications: NFC Forum Type 4 CIPURSE™ Data Rate: 106 kbps Delivery Forms: Sawn wafer 75 μm or 150 μm Delivery Forms: NiAu bump 20 μm EEPROM: 2.0kByte Interfaces: ISO 14443 A Interfaces: NFC Forum Type 4 Tag Interfaces: Configurable Security Features: Mutual authentication using AES-128 Tools: NFC Brand Protection Starter Kit Use Cases: Anti-counterfeiting Use Cases: Accessory Identification and authentication 更多

Applications: Consumer electronic accessories Applications: Consumables Applications: Luxury goods Applications: Track and trace Applications: Access control Applications: Toys Applications: Medical devices Applications: Pharmaceuticals Certifications: NFC Forum Type 4 CIPURSE™ Data Rate: 106 kbps Delivery Forms: Sawn wafer 75 μm Delivery Forms: NiAu bump 20 μm Delivery Forms: MCC8-2-6 EEPROM: 304.0Byte Interfaces: ISO 14443 A Interfaces: NFC Forum Type 4 Tag Interfaces: Configurable Security Features: Mutual authentication using AES-128 Tools: NFC Brand Protection Starter Kit Use Cases: Anti-counterfeiting 更多

NVM / 凌捷掩膜: 800.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 105.0°C Applications: automotive eSIM, eCall Delivery Forms: MFF2 (VQFN-8-4) Interfaces: I2C Interfaces: ISO 7816 Interfaces: SPI Interfaces: SWP Package: MFF2 Product Description: security cryptocontroller, Product Description: optimized for automotive applications Applications: V2X