Density: 4.0MBit Family: FAST SRAM Interfaces: Parallel Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V

Speed: 10.0ns Family: FAST SRAM Organization (X x Y): 2M x 16 Interfaces: Parallel Qualification: Industrial Lead Ball Finish: Pure Sn Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Operating Voltage: 2.2V Currently planned availability until at least: 2033

Lead Ball Finish: Ni/Pd/Au Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Organization (X x Y): 64K x 16 Qualification: Industrial Speed: 10.0ns Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 1.0MBit

Lead Ball Finish: Ni/Pd/Au Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Organization (X x Y): 64K x 16 Interfaces: Parallel Family: FAST SRAM Density: 1.0MBit

Architecture: QDR-IV Bank Switching: N ECC: Y Family: QDR-IV Frequency: 633.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature max: 85.0°C Organization (X x Y): 8Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 5.0 Data Width: x 18 Burst Length(Words): 2 Operating Voltage max: 1.34V Interfaces: Parallel Density: 144.0MBit

封装/外壳: None 包装: None 最小包装: None 长x宽/尺寸: None

Density: 1.0MBit Family: Excelon™ Frequency: 108.0MHz Interfaces: QSPI Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Organization (X x Y): 128Kb x 8 Peak Reflow Temp: 260.0°C Qualification: Automotive(E)