Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Organization (X x Y): 64K x 16 Speed: 45.0ns Interfaces: Parallel Family: MoBL™ SRAM Density: 1024.0kBit

Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 256K x 8 Peak Reflow Temp: 260.0°C Speed: 45.0ns Lead Ball Finish: Pure Sn Interfaces: Parallel Family: MoBL™ SRAM Density: 2048.0kBit Qualification: Automotive

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 64K x 16 Peak Reflow Temp: 260.0°C Speed: 10.0ns Qualification: Industrial Interfaces: Parallel Family: FAST SRAM Density: 1024.0kBit

Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 128K x 8 Peak Reflow Temp: 260.0°C Speed: 45.0ns Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Density: 1024.0kBit Qualification: Automotive

Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Qualification: Industrial Speed: 45.0ns Peak Reflow Temp: 260.0°C Organization (X x Y): 128K x 8 Interfaces: Parallel Family: MoBL™ SRAM Density: 1024.0kBit

Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 128K x 16 Peak Reflow Temp: 260.0°C Speed: 55.0ns Operating Voltage: NoneV Lead Ball Finish: Ni/Pd/Au Interfaces: Parallel Family: MoBL™ SRAM Density: 2048.0kBit Qualification: Automotive

Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512K x 16 Speed: 55.0ns Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Density: 8192.0kBit Qualification: Automotive

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit

Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Organization (X x Y): 128K x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 45.0ns Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: MoBL™ SRAM Density: 2048.0kBit