Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Organization (X x Y): 512K x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit

CY7C1041G30-10ZSXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: High-Performance 4 Mbit FAST SRAM with Parallel Interface and Industrial Qualification

Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage: NoneV Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit
Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Qualification: Industrial Peak Reflow Temp: 260.0°C Organization (X x Y): 512K x 8 Speed: 10.0ns Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit
Lead Ball Finish: Pure Sn Operating Temperature: None°C Organization (X x Y): 256K x 8 Speed: 45.0ns Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: MoBL™ SRAM Density: 2048.0kBit Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit
Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit
Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit
Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 2M x 8 Qualification: Industrial Density: 16.0MBit
Lead Ball Finish: Pure Sn Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Speed: 45.0ns Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Density: 16384.0kBit Qualification: Automotive
Lead Ball Finish: Pure Sn Operating Temperature: None°C Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 15.0ns Operating Voltage: NoneV Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit