Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 128Kb x 16 Peak Reflow Temp: 260.0°C Qualification: Automotive(A) Speed: 10.0ns Interfaces: Parallel Family: FAST SRAM Density: 2048.0kBit
Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit
Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 256K x 16 Speed: 45.0ns Qualification: Industrial Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Density: 4096.0kBit
Lead Ball Finish: Pure Sn Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512K x 8 Qualification: Industrial Speed: 55.0ns Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Density: 4096.0kBit
Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit
Organization (X x Y): 32K x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Temperature: None°C Operating Voltage: NoneV Lead Ball Finish: Ni/Pd/Au Operating Voltage(VCCQ): NoneV Interfaces: Parallel Density: 256.0kBit
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 256K x 16 Qualification: Industrial Density: 4.0MBit

CY7C1061G30-10ZSXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: High-Density 16 Mbit Parallel FAST SRAM with Industrial Qualification and Fast Access Time

Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Organization (X x Y): 1M x 16 Speed: 15.0ns Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit
Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 128K x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage: NoneV Lead Ball Finish: Ni/Pd/Au Interfaces: Parallel Family: FAST SRAM Density: 1024.0kBit