CY62148G30-45ZAXI
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 4Mb 3.0V Industrial 45ns x8 parallel MoBL™ SRAM with ECC in 32-pin sTSOP
Density: 4.0MBit
Interfaces: Parallel
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage: NoneV
Organization (X x Y): 512Kb x 8
Peak Reflow Temp: 260.0°C
Publish in NPSG: Y
Publish in PSG: Y
Qualification: Industrial
Speed: 45.0ns
CY62167EV30LL-45BVXI
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: High-Density 16MBit MoBL™ Parallel SRAM | Sn/Ag/Cu Finish - Ideal for Industrial Applications, Wide Operating Range
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 1M x 16
Qualification: Industrial
Density: 16.0MBit
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 512K x 8
Peak Reflow Temp: 260.0°C
Speed: 10.0ns
Qualification: Industrial
Lead Ball Finish: Pure Sn
Interfaces: Parallel
Family: FAST SRAM
Density: 4096.0kBit
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Lead Ball Finish: Pure Sn
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Organization (X x Y): 2M x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 55.0ns
Operating Voltage: NoneV
Interfaces: Parallel
Family: MoBL™ SRAM
Density: 32768.0kBit
CY7C1041GN30-10ZSXI
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: High-Density 4 Mbit Parallel FAST SRAM with Industrial Qualification and Reliable Performance
Lead Ball Finish: Ni/Pd/Au
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 256K x 16
Speed: 10.0ns
Qualification: Industrial
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: FAST SRAM
Density: 4096.0kBit
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Organization (X x Y): 512K x 8
Operating Voltage: NoneV
Interfaces: Parallel
Family: FAST SRAM
Density: 4096.0kBit
Density: 8.0MBit
Interfaces: Parallel
Qualification: Industrial
Lead Ball Finish: Ni/Pd/Au
Operating Voltage: NoneV
Family: FAST SRAM
Operating Temperature: None°C
Organization (X x Y): 1M x 8
Peak Reflow Temp: 260.0°C
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 64K x 16
Qualification: Industrial
Density: 1.0MBit
Lead Ball Finish: Sn/Pb
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Operating Voltage: NoneV
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 1M x 16
Qualification: Industrial
Density: 16.0MBit