S27KL0642DPBHI033


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 3.0 V Industrial (85°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA

Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: KL-2 Initial Access Time: 36.0ns Lead Ball Finish: N/A Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Density: 64.0MBit

S27KL0643DPBHA023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 3.0 V Automotive (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA

Initial Access Time: 36.0ns Interface Frequency (SDR/DDR)(MHz): - / 166 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: KL-3 Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Qualification: Automotive Density: 64.0MBit

S27KL0642DPBHB020


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 3.0 V Automotive (105°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA

Family: KL-2 Interface Frequency (SDR/DDR)(MHz): - / 166 Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 36.0ns Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Density: 64.0MBit

S70KL1283GABHB020


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 128MBit 3.0 V Automotive (105°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA

Family: KL-3 Initial Access Time: 35.0ns Interface Frequency (SDR/DDR)(MHz): - / 200 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Technology: HYPERRAM Interface Bandwidth: 400.0MByte/s Qualification: Automotive Density: 128.0MBit
Density: 256.0MBit Operating Voltage: 1.8V Qualification: Automotive Family: KS-4 Interface Frequency (SDR/DDR): - / 200 Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Interfaces: HYPERBUS x16

S27KL0642DPBHB023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 3.0 V Automotive (105°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA

Family: KL-2 Interface Frequency (SDR/DDR)(MHz): - / 166 Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 36.0ns Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Density: 64.0MBit

S27KL0642GABHV023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 3.0 V Industrial (105°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA

Interface Frequency (SDR/DDR)(MHz): - / 200 Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 35.0ns Family: KL-2 Technology: HYPERRAM Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Density: 64.0MBit

S27KS0643GABHI023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 64MBit 1.8 V Industrial (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA

Family: KS-3 Interface Frequency (SDR/DDR)(MHz): - / 200 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Initial Access Time: 35.0ns Technology: HYPERRAM Interface Bandwidth: 400.0MByte/s Qualification: Industrial Density: 64.0MBit

S70KL1283DPBHB023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 128MBit 3.0 V Automotive (105°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA

Family: KL-3 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 36.0ns Interface Frequency (SDR/DDR)(MHz): - / 166 Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Qualification: Automotive Density: 128.0MBit

S70KL1283DPBHI023


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)

描述: 128MBit 3.0 V Industrial (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA

Family: KL-3 Initial Access Time: 36.0ns Interface Frequency (SDR/DDR)(MHz): - / 166 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Technology: HYPERRAM Interface Bandwidth: 333.0MByte/s Qualification: Industrial Density: 128.0MBit