Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 512K x 36 Qualification: Commercial Density: 18.0MBit

Architecture: NoBL, Pipeline Data Width: x 36 ECC: N Family: NoBL Frequency: 167.0MHz On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 Bank Switching: N Organization (X x Y): 2Mb x 36 Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Burst Length(Words): 2 Data Width: x 36 ECC: N Family: QDR-II+ Frequency: 250.0MHz Interfaces: Parallel Lead Ball Finish: Sn/Pb Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Read Latency (Cycles): 2.0 Bank Switching: N On-Die Termination: N Architecture: QDR-II+ Qualification: Industrial(Q) Operating Voltage: NoneV Peak Reflow Temp: 220.0°C Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II+, ODT Bank Switching: N Burst Length(Words): 4 Data Width: x 18 Family: QDR-II+, ODT Lead Ball Finish: Sn/Pb Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 Frequency: 550.0MHz ECC: N On-Die Termination: Y Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II+, ODT Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Frequency: 550.0MHz Organization (X x Y): 2M x 18 Qualification: Industrial Density: 36.0MBit

Bank Switching: N Data Width: x 9 ECC: N Family: QDR-II Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Organization (X x Y): 8Mb x 9 Peak Reflow Temp: 260.0°C Qualification: Commercial Architecture: QDR-II On-Die Termination: N Burst Length(Words): 2 Read Latency (Cycles): 1.5 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 Data Width: x 18 Family: QDR-II On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Qualification: Commercial Read Latency (Cycles): 1.5 Peak Reflow Temp: 260.0°C ECC: N Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Bank Switching: N Burst Length(Words): 4 Data Width: x 18 ECC: N Family: QDR-II+, ODT Frequency: 500.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 Architecture: QDR-II+, ODT On-Die Termination: Y Organization (X x Y): 4Mb x 18 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II+, ODT Burst Length(Words): 4 ECC: N Family: QDR-II+, ODT Frequency: 550.0MHz Lead Ball Finish: Sn/Pb Operating Temperature: None°C Organization (X x Y): 4Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Bank Switching: N On-Die Termination: Y Data Width: x 36 Read Latency (Cycles): 2.5 Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 220.0°C Qualification: Industrial Read Latency (Cycles): 1.0 ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit