Interfaces: Parallel Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512Kb x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 25.0ns Density: 8192.0kBit
Alarms: Y Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 1Mb x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Real Time Clock: Y Speed: 25.0ns Watchdog Timer: Y Interfaces: Parallel Lead Ball Finish: Pure Sn Operating Voltage: NoneV Density: 16384.0kBit
Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 32Kb x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Interfaces: Parallel Speed: 25.0ns Density: 256.0kBit
Interfaces: Parallel Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512Kb x 16 Qualification: Industrial Speed: 45.0ns Peak Reflow Temp: 260.0°C Density: 8192.0kBit
Operating Temperature: None°C Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Organization (X x Y): 32K x 8 Qualification: Industrial Density: 256.0kBit Operating Voltage: NoneV
Frequency: 40.0MHz Interfaces: SPI Lead Ball Finish: Pure Sn Operating Voltage(VCCQ): NoneV Organization (X x Y): 32Kb x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Real Time Clock: Y Speed: 0.0ns Watchdog Timer: Y Operating Voltage: NoneV Alarms: Y Operating Temperature: None°C Density: 256.0kBit
Interfaces: Parallel Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 128Kb x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 45.0ns Operating Voltage: NoneV Density: 1024.0kBit
Frequency: 3.4MHz Interfaces: I2C Lead Ball Finish: Pure Sn Operating Temperature: None°C Organization (X x Y): 8Kb x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial(Q) Speed: 0.0ns Density: 64.0kBit Operating Voltage: NoneV
Interfaces: Parallel Lead Ball Finish: Sn/Ag/Cu Organization (X x Y): 256Kb x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Operating Temperature: None°C Speed: 45.0ns Density: 4096.0kBit Operating Voltage: NoneV
Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Organization (X x Y): 512K x 8 Qualification: Industrial Density: 4.0MBit