Interfaces: Parallel
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 512Kb x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 25.0ns
Density: 8192.0kBit
Alarms: Y
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Organization (X x Y): 1Mb x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Real Time Clock: Y
Speed: 25.0ns
Watchdog Timer: Y
Interfaces: Parallel
Lead Ball Finish: Pure Sn
Operating Voltage: NoneV
Density: 16384.0kBit
Lead Ball Finish: Ni/Pd/Au
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 32Kb x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Interfaces: Parallel
Speed: 25.0ns
Density: 256.0kBit
Interfaces: Parallel
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 512Kb x 16
Qualification: Industrial
Speed: 45.0ns
Peak Reflow Temp: 260.0°C
Density: 8192.0kBit
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Lead Ball Finish: Sn/Ag/Cu
Interfaces: Parallel
Organization (X x Y): 32K x 8
Qualification: Industrial
Density: 256.0kBit
Operating Voltage: NoneV
Frequency: 40.0MHz
Interfaces: SPI
Lead Ball Finish: Pure Sn
Operating Voltage(VCCQ): NoneV
Organization (X x Y): 32Kb x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Real Time Clock: Y
Speed: 0.0ns
Watchdog Timer: Y
Operating Voltage: NoneV
Alarms: Y
Operating Temperature: None°C
Density: 256.0kBit
Interfaces: Parallel
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Organization (X x Y): 128Kb x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 45.0ns
Operating Voltage: NoneV
Density: 1024.0kBit
Frequency: 3.4MHz
Interfaces: I2C
Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Organization (X x Y): 8Kb x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial(Q)
Speed: 0.0ns
Density: 64.0kBit
Operating Voltage: NoneV
Interfaces: Parallel
Lead Ball Finish: Sn/Ag/Cu
Organization (X x Y): 256Kb x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Operating Temperature: None°C
Speed: 45.0ns
Density: 4096.0kBit
Operating Voltage: NoneV
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Operating Temperature: None°C
Lead Ball Finish: Sn/Ag/Cu
Interfaces: Parallel
Organization (X x Y): 512K x 8
Qualification: Industrial
Density: 4.0MBit