Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 45.0ns Organization (X x Y): 512K x 16 Interfaces: Parallel Family: MoBL™ SRAM Density: 8192.0kBit

Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Organization (X x Y): 1M x 16 Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

Architecture: Standard Sync, Flow-through Bank Switching: N Burst Length(Words): 4 Data Width: x 18 Family: Synchronous SRAM with ECC Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 ECC: Y Frequency: 133.0MHz Organization (X x Y): 1Mb x 18 Operating Voltage max: 3.6V Interfaces: Parallel Density: 18.0MBit

Family: DDR-II+ CIO Operating Temperature max: 70.0°C Operating Voltage max: 1.9V Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Frequency: 400.0MHz Organization (X x Y): 1M x 36 Qualification: Commercial Density: 36.0MBit

Family: DDR-II CIO Lead Ball Finish: Sn/Ag/Cu Operating Voltage max: 1.9V Peak Reflow Temp: 260.0°C Operating Temperature max: 70.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 18 Qualification: Commercial Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 ECC: Y Family: Synchronous SRAM with ECC Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature max: 85.0°C Organization (X x Y): 1Mb x 18 Qualification: Industrial Read Latency (Cycles): 2.0 Data Width: x 18 Peak Reflow Temp: 260.0°C Operating Voltage max: 3.6V Interfaces: Parallel Density: 18.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 2M x 8 Peak Reflow Temp: 260.0°C Speed: 10.0ns Qualification: Industrial Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

Alarms: N Interfaces: Parallel Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512Kb x 16 Real Time Clock: N Watchdog Timer: N Peak Reflow Temp: 260.0°C Qualification: Automotive(A) Speed: 45.0ns Lead Ball Finish: Sn/Ag/Cu Family: MoBL™ SRAM Density: 8192.0kBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 ECC: Y Family: Synchronous SRAM with ECC Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature max: 85.0°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 Data Width: x 36 Frequency: 167.0MHz Operating Voltage max: 3.6V Interfaces: Parallel Density: 18.0MBit

Family: DDR-II CIO Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 70.0°C Operating Voltage max: 1.9V Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 1M x 18 Qualification: Commercial Density: 18.0MBit