Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N Frequency: 250.0MHz Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.0 Family: NoBL Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: QDR-IV Burst Length(Words): 2 Data Width: x 36 Family: QDR-IV Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 4Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 8.0 Frequency: 933.0MHz ECC: Y Bank Switching: Y Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: QDR-II+, ODT Bank Switching: N Burst Length(Words): 4 ECC: N Family: QDR-II+, ODT Frequency: 450.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Qualification: Commercial Read Latency (Cycles): 2.5 Data Width: x 18 Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: QDR-II+, ODT Bank Switching: N Burst Length(Words): 4 Data Width: x 36 ECC: N Family: QDR-II+, ODT Frequency: 450.0MHz On-Die Termination: Y Organization (X x Y): 4Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.5 Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: NoBL Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 ECC: N Frequency: 167.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 Family: NoBL Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 ECC: N Frequency: 250.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 18 Qualification: Commercial Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N ECC: N Family: NoBL Frequency: 167.0MHz Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Qualification: Commercial On-Die Termination: N Peak Reflow Temp: 260.0°C Data Width: x 36 Read Latency (Cycles): 1.0 Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 Family: NoBL Frequency: 200.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 ECC: N Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II Bank Switching: N Data Width: x 9 Family: QDR-II Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 8Mb x 9 Qualification: Industrial(Q) Read Latency (Cycles): 1.5 ECC: N Peak Reflow Temp: 260.0°C Burst Length(Words): 2 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit