Architecture: NoBL, Pipeline Bank Switching: N Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Data Width: x 36 Read Latency (Cycles): 1.0 ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 Data Width: x 18 Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 18 Qualification: Commercial Read Latency (Cycles): 2.0 Peak Reflow Temp: 260.0°C ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 18 ECC: N Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Qualification: Commercial Read Latency (Cycles): 2.0 Burst Length(Words): 4 Organization (X x Y): 1Mb x 18 Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: QDR-II+, ODT Bank Switching: N Burst Length(Words): 4 ECC: N Family: QDR-II+, ODT Frequency: 500.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 2.5 Data Width: x 18 Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 18 Qualification: Commercial Density: 36.0MBit

Bank Switching: N Data Width: x 36 ECC: N Family: NoBL Frequency: 200.0MHz Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Architecture: NoBL, Pipeline Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 9 Qualification: Commercial Density: 36.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 220.0°C Interfaces: Parallel Frequency: 333.0MHz Organization (X x Y): 1M x 18 Qualification: Commercial Density: 18.0MBit

Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Architecture: Standard Sync, Pipeline SCD Data Width: x 36 ECC: N Family: Standard Sync Frequency: 167.0MHz On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Bank Switching: N Organization (X x Y): 2Mb x 36 Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit