Family: QDR-II+ Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 450.0MHz Organization (X x Y): 1M x 36 Qualification: Commercial Density: 36.0MBit

Architecture: QDR-II+, ODT Burst Length(Words): 2 ECC: N Family: QDR-II+, ODT Frequency: 333.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 Data Width: x 36 Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Bank Switching: N Burst Length(Words): 4 ECC: N Family: QDR-II+, ODT Frequency: 450.0MHz Lead Ball Finish: Sn/Pb Operating Temperature: None°C Organization (X x Y): 4Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Architecture: QDR-II+, ODT On-Die Termination: Y Data Width: x 36 Read Latency (Cycles): 2.5 Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Family: QDR-II+ Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Frequency: 450.0MHz Organization (X x Y): 2M x 36 Qualification: Commercial Density: 72.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Family: QDR-II+ Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Operating Temperature: None°C Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 400.0MHz Organization (X x Y): 512K x 36 Qualification: Commercial Density: 18.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N ECC: N Family: Standard Sync Frequency: 133.0MHz Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Organization (X x Y): 1Mb x 36 Qualification: Industrial Read Latency (Cycles): 1.0 Data Width: x 36 Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N ECC: N Frequency: 166.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Family: NoBL Qualification: Industrial Data Width: x 36 Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: Standard Sync, Pipeline SCD Data Width: x 36 ECC: N Family: Standard Sync Frequency: 200.0MHz On-Die Termination: N Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Bank Switching: N Organization (X x Y): 256Kb x 36 Operating Temperature: None°C Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Family: NoBL On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 ECC: N Frequency: 200.0MHz Data Width: x 18 Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit