Architecture: QDR-II+ Xtreme Bank Switching: N Burst Length(Words): 2 Data Width: x 18 ECC: N Frequency: 366.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 18 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 2.5 Family: QDR-II+ Xtreme Qualification: Commercial Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Bank Switching: N Data Width: x 36 ECC: N Family: Standard Sync Frequency: 250.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 220.0°C Qualification: Industrial Read Latency (Cycles): 1.0 Architecture: Standard Sync, Pipeline SCD Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Bank Switching: N Burst Length(Words): 4 ECC: N Family: QDR-II+, ODT Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 Data Width: x 18 Frequency: 550.0MHz Architecture: QDR-II+, ODT Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Pipeline SCD Data Width: x 36 ECC: N Family: Standard Sync Frequency: 166.0MHz On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 Bank Switching: N Organization (X x Y): 256Kb x 36 Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Bank Switching: N Burst Length(Words): 4 Data Width: x 18 ECC: N Family: QDR-II+, ODT Frequency: 550.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 Architecture: QDR-II+, ODT Organization (X x Y): 2Mb x 18 Operating Temperature: None°C Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N ECC: N Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.0 Peak Reflow Temp: 260.0°C On-Die Termination: N Data Width: x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Flow-through Data Width: x 36 ECC: N Family: NoBL Frequency: 133.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Bank Switching: N Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N Frequency: 166.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au On-Die Termination: N Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Operating Temperature: None°C Family: NoBL Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Burst Length(Words): 4 ECC: N Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 2.0 Data Width: x 36 Family: Standard Sync Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Family: QDR-II Operating Voltage: NoneV Interfaces: Parallel Frequency: 333.0MHz Organization (X x Y): 2M x 18 Qualification: Industrial Density: 36.0MBit