Architecture: NoBL, Flow-through Bank Switching: N Family: NoBL Frequency: 133.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Qualification: Commercial ECC: N Peak Reflow Temp: 260.0°C Data Width: x 36 Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Organization (X x Y): 512Kb x 36 Qualification: Commercial Read Latency (Cycles): 2.0 Operating Temperature: None°C ECC: N Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: Standard Sync, Flow-through Burst Length(Words): 4 Data Width: x 18 ECC: N Family: Standard Sync Frequency: 133.0MHz Lead Ball Finish: Pure Sn Organization (X x Y): 1Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Operating Temperature: None°C Bank Switching: N On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Data Width: x 36 Frequency: 133.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial ECC: N Family: Standard Sync Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Family: QDR-II+ Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 450.0MHz Organization (X x Y): 4M x 18 Qualification: Commercial Density: 72.0MBit

Architecture: NoBL, Pipeline Data Width: x 36 ECC: N Frequency: 200.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 220.0°C Read Latency (Cycles): 1.0 Family: NoBL Qualification: Industrial Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Family: QDR-II Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 18 Qualification: Industrial Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N Frequency: 200.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 Family: NoBL Operating Temperature: None°C Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.5 ECC: N Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Data Width: x 18 ECC: N Family: NoBL Frequency: 200.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Bank Switching: N Architecture: NoBL, Pipeline Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit