Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Family: NoBL Qualification: Commercial Frequency: 167.0MHz Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Data Width: x 36 ECC: N Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 220.0°C Family: NoBL Qualification: Industrial Frequency: 167.0MHz Bank Switching: N Read Latency (Cycles): 1.0 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II+ Xtreme Bank Switching: Y Burst Length(Words): 2 ECC: N Family: QDR-II+ Xtreme Frequency: 450.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.5 Data Width: x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Bank Switching: N Data Width: x 18 ECC: N Lead Ball Finish: Pure Sn;Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 18 Qualification: Industrial Read Latency (Cycles): 1.0 Frequency: 166.0MHz Family: NoBL Peak Reflow Temp: 260.0°C Architecture: NoBL, Pipeline Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Family: QDR-II Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Pb Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 9 Qualification: Commercial Density: 36.0MBit

Architecture: QDR-II Burst Length(Words): 4 ECC: N Family: QDR-II Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Data Width: x 36 Organization (X x Y): 4Mb x 36 Read Latency (Cycles): 1.5 Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: Standard Sync Frequency: 167.0MHz On-Die Termination: N Operating Temperature: None°C Qualification: Commercial Read Latency (Cycles): 2.0 Peak Reflow Temp: 260.0°C Lead Ball Finish: Pure Sn ECC: N Organization (X x Y): 512Kb x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Data Width: x 36 ECC: N Frequency: 100.0MHz Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Qualification: Automotive(E) Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: Standard Sync Frequency: 100.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Qualification: Industrial Read Latency (Cycles): 1.0 Peak Reflow Temp: 260.0°C ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Bank Switching: N Data Width: x 36 Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C ECC: N Frequency: 100.0MHz Architecture: Standard Sync, Flow-through Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit Qualification: Automotive