Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Family: QDR-II+ Xtreme Interfaces: Parallel Organization (X x Y): 2M x 36 Qualification: Commercial Density: 72.0MBit

Family: QDR-II Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 1M x 18 Qualification: Commercial Density: 18.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 18 ECC: N Frequency: 200.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Family: NoBL Qualification: Commercial Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 Data Width: x 9 ECC: N Family: QDR-II Frequency: 300.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 9 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.5 Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Family: QDR-II Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 1M x 36 Qualification: Industrial Density: 36.0MBit

Architecture: QDR-II Burst Length(Words): 2 Data Width: x 9 ECC: N Family: QDR-II Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.5 Bank Switching: N Organization (X x Y): 8Mb x 9 Frequency: 250.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-II+ Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: QDR-II+ Frequency: 550.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 ECC: N Organization (X x Y): 4Mb x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Data Width: x 18 ECC: N Frequency: 166.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Family: Standard Sync Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 ECC: N Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Qualification: Commercial Read Latency (Cycles): 1.5 Data Width: x 18 Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Data Width: x 36 ECC: N Family: Standard Sync Frequency: 167.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial On-Die Termination: N Read Latency (Cycles): 1.0 Organization (X x Y): 2Mb x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit