Architecture: Standard Sync, Flow-through Bank Switching: N ECC: N Frequency: 100.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 128Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Automotive(E) Lead Ball Finish: Sn/Ag/Cu Data Width: x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 4096.0kBit Density: 4.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 4 ECC: N Family: QDR-II Frequency: 300.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Organization (X x Y): 4Mb x 36 Qualification: Industrial Read Latency (Cycles): 1.5 Operating Temperature: None°C Data Width: x 36 Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 18 Qualification: Industrial Density: 72.0MBit

Family: QDR-II+ Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 550.0MHz Organization (X x Y): 2M x 36 Qualification: Commercial Density: 72.0MBit

Architecture: NoBL, Pipeline Data Width: x 36 ECC: N Family: NoBL Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Bank Switching: N Frequency: 250.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Data Width: x 36 ECC: N Family: Standard Sync Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.0 On-Die Termination: N Frequency: 250.0MHz Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N Family: NoBL Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 On-Die Termination: N Frequency: 167.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 Family: NoBL Frequency: 166.0MHz Lead Ball Finish: Pure Sn;Ni/Pd/Au Qualification: Industrial Read Latency (Cycles): 1.0 Peak Reflow Temp: 260.0°C ECC: N Organization (X x Y): 256Kb x 36 Operating Temperature: None°C On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 Data Width: x 18 Family: NoBL Frequency: 200.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 18 Qualification: Commercial Read Latency (Cycles): 2.0 ECC: N Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: QDR-II Burst Length(Words): 2 Data Width: x 9 ECC: N Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.5 Organization (X x Y): 4Mb x 9 Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit