Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Family: QDR-II Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 1M x 18 Qualification: Industrial Density: 18.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 Data Width: x 36 ECC: N Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.5 On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: Standard Sync Frequency: 133.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Qualification: Industrial Read Latency (Cycles): 1.0 ECC: N Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 Data Width: x 36 Family: QDR-II Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.5 Peak Reflow Temp: 260.0°C ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: NoBL, Pipeline Data Width: x 18 ECC: N On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 18 Peak Reflow Temp: 260.0°C Family: NoBL Qualification: Commercial Frequency: 250.0MHz Bank Switching: N Read Latency (Cycles): 1.0 Lead Ball Finish: Ni/Pd/Au Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: QDR-II+ Burst Length(Words): 4 Data Width: x 18 ECC: N Family: QDR-II+ Lead Ball Finish: Sn/Pb Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 Bank Switching: N On-Die Termination: N Frequency: 450.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 2M x 18 Qualification: Commercial Density: 36.0MBit

Family: QDR-II+ Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Frequency: 400.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N ECC: N Family: NoBL Frequency: 250.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Lead Ball Finish: Pure Sn Data Width: x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit