Family: QDR-II Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 300.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Data Width: x 36 ECC: N Family: NoBL Frequency: 250.0MHz On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 Bank Switching: N Organization (X x Y): 2Mb x 36 Architecture: NoBL, Pipeline Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 36 ECC: N Family: NoBL Frequency: 200.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Pipeline Data Width: x 36 ECC: N Family: NoBL Frequency: 200.0MHz Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Organization (X x Y): 2Mb x 36 On-Die Termination: N Qualification: Commercial Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 333.0MHz Organization (X x Y): 2M x 36 Qualification: Industrial Density: 72.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Burst Length(Words): 4 ECC: N Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 Organization (X x Y): 512Kb x 36 Data Width: x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: QDR-II+, ODT Bank Switching: N Data Width: x 18 Family: QDR-II+, ODT Frequency: 550.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.5 ECC: N Burst Length(Words): 4 Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: NoBL, Pipeline Bank Switching: N Data Width: x 18 Family: NoBL Frequency: 167.0MHz On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Qualification: Industrial Read Latency (Cycles): 1.0 Peak Reflow Temp: 260.0°C ECC: N Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N ECC: N Frequency: 167.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.0 Data Width: x 36 Family: Standard Sync Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II+ Lead Ball Finish: Sn/Pb Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 400.0MHz Organization (X x Y): 4M x 18 Qualification: Industrial Density: 72.0MBit