Architecture: QDR-II+, ODT Bank Switching: N Data Width: x 36 ECC: N Family: QDR-II+, ODT Frequency: 550.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Organization (X x Y): 4Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 2.5 Operating Temperature: None°C Burst Length(Words): 4 Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: NoBL, Pipeline Bank Switching: N ECC: N Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Data Width: x 36 Family: NoBL Frequency: 167.0MHz Read Latency (Cycles): 1.0 Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: Standard Sync, Pipeline DCD Bank Switching: N Data Width: x 36 Family: Standard Sync Frequency: 250.0MHz Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Qualification: Commercial Read Latency (Cycles): 1.0 ECC: N Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: QDR-II Bank Switching: N Burst Length(Words): 2 Data Width: x 9 Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 16Mb x 9 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 1.5 ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Data Width: x 18 ECC: N Frequency: 200.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 4Mb x 18 Peak Reflow Temp: 220.0°C Read Latency (Cycles): 1.0 Family: Standard Sync Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Family: QDR-II Lead Ball Finish: Sn/Pb Operating Voltage: NoneV Operating Temperature: None°C Peak Reflow Temp: 260.0°C Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 18 Qualification: Industrial Density: 72.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Data Width: x 36 ECC: N Family: Standard Sync Frequency: 133.0MHz Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Organization (X x Y): 1Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.0 On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 36864.0kBit Density: 36.0MBit

Architecture: QDR-II Burst Length(Words): 2 Data Width: x 18 Family: QDR-II Frequency: 333.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.5 ECC: N Bank Switching: N Qualification: Commercial Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Lead Ball Finish: Sn/Pb Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Family: QDR-II Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 4M x 18 Qualification: Industrial Density: 72.0MBit

Bank Switching: N Data Width: x 36 Family: Standard Sync On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial ECC: N Frequency: 133.0MHz Architecture: Standard Sync, Flow-through Lead Ball Finish: Pure Sn Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit