Family: QDR-II+, ODT Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Frequency: 550.0MHz Organization (X x Y): 2Mb x 36 Qualification: Commercial Density: 72.0MBit

Architecture: QDR-II+ Bank Switching: N Data Width: x 36 ECC: N Frequency: 450.0MHz Lead Ball Finish: Sn/Pb On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 2.5 Burst Length(Words): 4 Qualification: Industrial Family: QDR-II+ Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Family: QDR-II Operating Temperature: None°C Interfaces: Parallel Frequency: 300.0MHz Organization (X x Y): 1M x 36 Qualification: Industrial Density: 36.0MBit

Architecture: Standard Sync, Pipeline SCD Burst Length(Words): 4 Data Width: x 36 ECC: N Family: Standard Sync Lead Ball Finish: Pure Sn Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 2.0 Bank Switching: N On-Die Termination: N Frequency: 167.0MHz Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Family: QDR-II+, ODT Interfaces: Parallel Frequency: 400.0MHz Organization (X x Y): 2Mb x 36 Qualification: Industrial Density: 72.0MBit

Architecture: Standard Sync, Flow-through Data Width: x 36 ECC: N Frequency: 100.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C Qualification: Automotive(E) Bank Switching: N Operating Temperature: None°C Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: NoBL, Flow-through Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: NoBL Frequency: 133.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 ECC: N Qualification: Commercial Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: NoBL, Pipeline ECC: N Family: NoBL Frequency: 167.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Qualification: Industrial Data Width: x 36 Bank Switching: N Read Latency (Cycles): 1.0 Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit

Architecture: QDR-IV Bank Switching: Y Burst Length(Words): 2 Data Width: x 18 Family: QDR-IV Frequency: 933.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: Y Operating Temperature: None°C Organization (X x Y): 8Mb x 18 Peak Reflow Temp: 260.0°C Qualification: Commercial Read Latency (Cycles): 8.0 ECC: Y Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N ECC: N Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 2Mb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Data Width: x 36 Frequency: 133.0MHz Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Density: 73728.0kBit Density: 72.0MBit